DM04 Custom Aluminum Heatsink Enclosure
The DM04 is a customizable extruded aluminum enclosure designed for industrial computer integration. Its finned structure provides a large external heat-dissipation surface, while CNC-machined panels and internal mounting features can be adapted to project requirements.
Product Overview
- Extruded aluminum heatsink enclosure
- Customizable front and rear panels
- Internal component mounting points
- Thermal block integration options
- Wall or panel mounting base
- Multiple enclosure and panel configurations
The images show example configurations. Panel cutouts, mounting layouts and thermal components can be customized for different hardware projects.
Exterior Views
These views show example enclosure orientations, CNC-machined panel openings and mounting features. Interface layouts can be adapted to the selected hardware.
Custom USB I/O Panel
Front Panel CNC Cutouts
Bottom Mounting Plate
Extruded Enclosure Side View
Enclosure Structure
The enclosure uses a finned aluminum extrusion with an open internal assembly structure, an external heatsink surface and an example thermal contact area.
Open Extrusion Structure
Example Thermal Contact Area
Internal Thermal Integration
The internal view presents an example copper thermal block, mounting standoffs, wiring and component arrangement. Thermal components and internal layouts are project-specific and shown for reference.
Internal Thermal Block Assembly
Dimensions
Dimensions shown are based on the illustrated extrusion profile. Enclosure length and panel configuration may vary by project.
Extrusion Profile Dimensions
- Overall width: 205 mm
- Internal width: 178 mm
- Overall height: 56.5 mm
- Internal height: 38.5 mm
- Visible top section dimension: 5 mm
Design and Customization
CAD-based enclosure development can support custom front and rear panels, mounting plate customization, CNC-machined cutouts and assembly design review.
CAD and Exploded Assembly View
Customize the DM04 for Your Hardware Project
Share your motherboard layout, I/O requirements, enclosure length, mounting method and thermal design needs with our team.