DM20 Custom Aluminum Fanless Industrial PC Enclosure

Model DM20 is a custom extruded aluminum enclosure designed for fanless industrial PC integration, CNC-machined I/O configurations and efficient passive heat dissipation.

DM20 custom aluminum fanless industrial PC enclosure main view

Key Features

  • Extruded enclosure body with external passive cooling fins
  • Customizable CNC-machined front and rear I/O panels
  • Removable bottom mounting plate
  • Configurable internal mounting and thermal-transfer structure
  • Mounting flanges for equipment integration

Images show a current reference configuration. Panel openings, mounting details and internal arrangements can be adapted to the selected industrial PC hardware.

Product Gallery

Open any image to view the original file and examine the visible panel, enclosure and mounting details.

Dimensions and Structure

Dimensions shown are based on the current reference configuration and may be customized for project requirements.

DM20 industrial PC enclosure drawing with confirmed overall dimensions

Overall Reference Dimensions

  • Overall mounting width: 228 mm
  • Enclosure depth shown: 193.7 mm
  • Overall height shown: 66 mm
DM20 aluminum extrusion cross-section with width and height measurements

Extrusion Cross-Section

  • Enclosure body width: 204 mm
  • Intermediate width: 190 mm
  • Internal width: 179 mm
  • Cross-section height: 64 mm
  • Internal height shown: 46 mm

Customization Capabilities

  • Custom CNC-machined front and rear panels
  • Flexible I/O cutouts
  • Aluminum extrusion heatsink structure
  • Internal thermal block customization
  • Bottom mounting plate customization
  • Surface finish and color options
  • OEM and ODM enclosure development

Applications

  • Fanless industrial PC integration
  • Embedded control computers
  • Industrial automation equipment
  • Edge computing hardware enclosures
  • Project-specific OEM and ODM computer systems

Request a Quote for the DM20

Share your motherboard layout, required I/O openings, mounting method, enclosure dimensions and thermal integration needs for a project review.